关键词 |
汉高ABLESTIKJM7000导电胶 |
面向地区 |
ABLESTIK JM7000具有高可靠性，低空洞特点，耐高温可达370度。
常用超大规模集成电路封装，陶瓷焊接封装和焊接密封封装
LOCTITE ABLESTIK JM 7000 die attach adhesive has been
formulated for use in high throughput die attach applications. This
material has been used successfully on rigid substrates with die sizes
up to 700 mils.
LOCTITE ABLESTIK JM 7000 has been approved by DESC and
Rome Laboratory for military products.
安徽ablestik 5020胶膜 506胶膜 安徽汉高代理 上海汉高代理 苏州汉高代理 安徽导电胶 安徽乐泰代理 北京乐泰导电胶
